Automotive DesignLine Highlights

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Automotive smarts: Too much intelligence, not enough sense

Tech distractions

Triangulation in automotive ultrasonic park-assist systems

MCU functionalities change for ISO 26262 safety standard

Slideshow: Semi-autonomous features boost driver safety

Combo MEMS sensor use in cars growing rapidly

TI, Continental make 'stability' MCU for cars

Students build electric racing car

Slideshow: Inside McLaren's Formula 1 Racing Tech Center

Making roads safer with vehicle video recorders

How small vendors compete in analog IC market

Providing active balancing for series-connected batteries

Slideshow: Is Europe Stealth Semiconductor Research Leader?

Students test Freescale's MCUs in racing cars

MISRA C update addresses automotive software safety

NXP joins car-to-car comms consortium

Automotive safety: An ISO 26262 perspective

Digital isolators deliver automotive-grade quality, reliability

Using parallel FFT for multi-gigahertz FPGA signal processing

Renesas drives eight-core 'big-little' into automotive

Micronas, Synopsys team on automotive design

How M2M, small data will revolutionize the car industry

Automotive HMI: More than just a machine interface

Automotive Ethernet: Evolution in the fast lane

Imagination preps cores for vision processor market

Car infotainment to expand after soft growth in 2013

Slideshow: Automakers roll out dream cars

Honda recycles rare earth metals from hybrid car batteries

BASF teams with universities on materials research

High-speed measurements for electric, hybrid vehicles

Toshiba recognition processor helps drivers

Renesas, Elektrobit team on infotainment

Car infotainment systems need multi-output power ICs

Packaged telematics to meet tough automotive requirements

Slideshow: Diesels, turbochargers power Chicago Auto Show

Performing audio synthesis, noise reduction in cars

Mentor buys MontaVista automotive infotainment software unit

Delphi, NXP update deal with car radios

Selecting automotive display touch interface

ST, Hyundai team up to develop powertrain

Automotive Design Features

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Technical Papers

42V, 2.5A Synchronous Step-Down Regulator with 2.5μA Quiescent Current

Migrating from the MSP430F5/F6xx to the MSP430FR58/59xx Family

Minimizing energy consumption in capacitive sensing applications

Reduced Battery Current Using CC112x/CC1175/CC1200 with TPS62730

Cost effectively delivering high quality audio across the complete audio spectrum

Twelve Design Techniques for Successful Integration of Data Converter IP into an SoC

Improve Lithium-Ion Battery-Stack Safety in Electric Vehicles by Leveraging Optocouplers to Isolate High Voltages

How to Reduce Motor Size by Integrating Accurate, Low Cost Piezo Motors

ISO26262 in automotive IC development: is it just a tick-box exercise, or does it induce manufacturers to make safer components?

Implementing Digital Processing for Automotive Radar Using SoC FPGAs

More Technical Papers >

Courses and Webinars

EDN on LEDs Part 2: LED Lighting System Design

Connectivity Solutions for Next Gen Industrial Automation and Control

In-vehicle product differentiation: open standards vs open source

More Courses and Webinars >

Teardowns

Sperry vertical gyro for Boeing 747

Under the Hood: MotoGP electronics is where the rubber meets the road

CMOS power amplifiers penetrating 3G handsets

More Design Teardowns >

Reference Designs

Lattice adds over 90 reference designs for PLDs

Lattice Semiconductor Corp. has released more than 90 reference designs optimized for the MachXO and ispMACH 4000ZE PLDs.
Learn more >

Quantenna debuts 802.11n 4x4 MIMO wireless video bridge ref design

Quantenna Communications Inc. has debuted a complete reference design based on its QHS600 IEEE 802.11n wireless LAN (WLAN) 4x4 multiple input, multiple output (MIMO) chipset.
Learn more >

More Reference Designs >

Products

Op amps extend battery life with low power consumption

Auto MLCC series offers 0402 case size with X8R dieletric

ST EEPROMs guarantee 4 million erase/write cycles

TI 12-bit ADCs handle up to 900 Msamples/s

ADLINK boards support 4th generation Intel core processor

Scalable system platforms run the 4th Generation Intel Core and Xeon processors

Microchip’s unique ID family of EEPROMs debuts

X-ES rolls 4th generation Intel Core i7 processor-based SBCs

C&K designs switch for mirror control in automotive, industrial apps

Making yesterday’s parts with today’s green technology

More Products >

News, Analysis, and Opinion

Mobile video streaming drives demand for networking semiconductors in cars

MOST Forum sheds light on the future of automotive optical data communications

Slideshow: Is Europe Stealth Semiconductor Research Leader?

Geo Semi tackles video analytics

GapSense unclogs WiFi channels

China Fabless: Allwinner's secret to tablet IC success

Connected people meet the connected car

Mentor Graphics expands automotive Linux infotainment business

DAC Keynote from James Truchard

The good and bad of tablets at work

More News >

Commentary

Connectivity enables smart manufacturing

Al Presher

The push to achieve more intelligent, integrated manufacturing puts a strong focus on networking and connectivity.

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Automotive smarts: Too much intelligence, not enough sense

Richard Quinnell

If designers aren't careful, their intelligent systems will sometimes do stupid things.

post comment 2 comments last comment Roba66
Sounds like my Volvo, after several such events I put some Dow4 on the connector which solved the ...

Tech distractions

Jack Ganssle

The Amish are said to want to manage, rather than reject, technology. That's not a bad idea to emulate.

post comment 4 comments last comment zeeglen
Yes, it is inconvenient to have to pull over to allow a passenger to use the phone (almost like ...

DAC Keynote: Gregg Lowe

Brian Bailey

Gregg Lowe of Freescale gave the first of the keynotes at DAC 2013. He says that the Internet of Things will create several challenges such as power efficiency that have to be overcome…

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ARM TechCon 2013 – Call for Papers Now Open

Clive Maxfield

Now in its seventh year, ARM TechCon is ranked one of the top three critical events in the embedded sector.

post comment

Your chance to win an Exploration & Discovery experience and go behind the scenes at NASA!

Clive Maxfield

Littelfuse's Speed2Design Exploration & Discovery program brings engineers behind-the-scenes at NASA's Ames Research and Johnson Space Centers.

post comment 3 comments last comment Max the Magnificent
Bummer -- I didn't even check the rules because I'm not eligible to win (since I work for EE Times)

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Automotive technology coverage

The Automotive Designline is edited by Susan Rambo, who also edits the EE Times' Power Management Designline. We welcome submissions of design articles, case studies, product how-to articles as well as guest blogs together with news and technical information on new products. Contact Susan Rambo at susan.rambo@ubm.com.

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Automotive DesignLine Highlights

Automotive Design Features

Technical Papers

Courses and Webinars

Teardowns

Reference Designs

Products

News, Analysis, and Opinion

Commentary

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